Dongguan Yiding Technologies Co., Ltd.

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Rapid Prototyping Precision CNC Machined Parts For Semiconductor Equipment Parts

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Dongguan Yiding Technologies Co., Ltd.
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City:dongguan
Country/Region:china
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Rapid Prototyping Precision CNC Machined Parts For Semiconductor Equipment Parts

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Brand Name :Yiding
Certification :ISO9001:2015; Rhos
Place of Origin :Guanddong, China
MOQ :1
Payment Terms :L/C,D/A,D/P,T/T,Western Union,MoneyGram
Material Options :Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)
Processing Methods :CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping
Tolerance Capability :General ±0.01mm; High Precision up to ±0.005mm
Surface Finishing :Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting
Heat Treatment :Quenching, Tempering, Annealing, Stress Relieving (as required)
Inspection & Quality Control :100% inspection before shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing
Certification Available :ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate of Conformance)
Applications :Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders
Prototyping & Production :Rapid Prototyping, Small Batch Production, Large Volume Production
Lead Time :5–20 working days depending on order volume and complexity
Packaging :Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet – as per customer requirements
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Semiconductor production demands a wide range of specialized CNC machined parts for wafer manufacturing, oxidation, photolithography, etching, inspection, and more. These parts vary widely in complexity, size, and materials, and the right CNC equipment and knowledge is critical to manufacture them properly.

Whether you’re new to CNC machining for the semiconductor industry or you’re well-versed in making precision parts for the sector, here are a few things to keep in mind:


Precision is paramount.


For high-level semiconductor manufacturing, super-precise components are required for processes such as uniform chemical application or electrical property inspection. Special high-speed, high-precision machining solutions are often needed to optimize workpiece quality.


Study up on new materials.


The semiconductor manufacturing process uses components made from a wide range of non-metal materials such as ceramics, quartz, polyurethane, and silicone carbide. Each of these materials come with their own unique machining challenges, especially when taking into consideration the tight tolerances demanded by the industry.


Eliminate multiple processes.


To maintain vacuum sealing, components such as semiconductor chamber housings have both complex geometries and tight tolerances. The best machining strategy minimizes multiple part setups to help maximize both precision and productivity.


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